Noi o Semiconductor Chip Sputtering Target

Hiki i ka Rich Special Material Co., Ltd. ke hana i nā pahu pahu alumini maʻemaʻe kiʻekiʻe, nā pahu pahu keleawe, nā pahu pahu tantalum, nā pahu pahu titanium, a me nā mea'ē aʻe no kaʻoihana semiconductor.

Loaʻa i nā pahu semiconductor nā koi ʻenehana kiʻekiʻe a me nā kumukūʻai kiʻekiʻe no ka sputtering targets.ʻOi aku ka kiʻekiʻe o kā lākou mau koi no ka maʻemaʻe a me ka ʻenehana o ka sputtering targets ma mua o nā hōʻike papa pālahalaha, nā pūnaewele lā a me nā noi ʻē aʻe.Hoʻonohonoho nā ʻāpana Semiconductor i nā kūlana koʻikoʻi i ka maʻemaʻe a me ka microstructure kūloko o nā pahuhopu sputtering.Inā kiʻekiʻe loa ka ʻike haumia o ka pahu sputtering, ʻaʻole hiki i ke kiʻiʻoniʻoni ke hoʻokō i nā pono uila e pono ai.Ma ke kaʻina hana sputtering, maʻalahi ka hana ʻana i nā ʻāpana ma ka wafer, e hopena i ka pōʻino pōkole a i ʻole ka pōʻino, e hoʻopilikia nui i ka hana o ke kiʻiʻoniʻoni.ʻO ka ʻōlelo maʻamau, koi ʻia ka pahuhopu sputtering maʻemaʻe kiʻekiʻe loa no ka hana chip, ʻo ia ka mea maʻamau 99.9995% (5N5) a i ʻole.

Hoʻohana ʻia nā pahuhopu sputtering no ka hana ʻana i nā ʻāpana pale a me nā ʻāpana uwila metala.I ke kaʻina hana wafer, hoʻohana nui ʻia ka pahuhopu e hana i ka papa conductive, ka papa pale a me ka pahu metala o ka wafer.I ke kaʻina hana o ka puʻupuʻu chip, hoʻohana ʻia ka sputtering target e hana i nā papa metala, nā ʻāpana wili a me nā mea metala ʻē aʻe ma lalo o nā puʻupuʻu.ʻOiai ka liʻiliʻi o ka nui o nā mea waiwai i hoʻohana ʻia i ka hana wafer a me ka puʻupuʻu chip, e like me ka helu SEMI, ʻo ke kumukūʻai o nā mea i manaʻo ʻia i ka hana wafer a me ke kaʻina hana hoʻopili e pili ana i 3%.Eia nō naʻe, pili pono ka maikaʻi o ka pahu sputtering i ka kūlike a me ka hana o ka papa conductive a me ka papa pale, a laila e pili ana i ka wikiwiki o ka lawe ʻana a me ka paʻa o ka chip.No laila, ʻo ka sputtering target kekahi o nā kumu kumu no ka hana semiconductor