ʻIke mākou a pau ʻo ka sputtering kekahi o nā ʻenehana nui no ka hoʻomākaukau ʻana i nā mea kiʻiʻoniʻoni.Hoʻohana ʻo ia i nā ion i hana ʻia e ke kumu ion e hoʻolalelale i ka hōʻuluʻulu ʻana i loko o ka vacuum e hana i kahi kukuna ion kiʻekiʻe, hoʻopaʻa i ka ʻili paʻa, a hoʻololi nā ion i ka ikehu kinetic me nā ʻātoma ma ka ʻili paʻa, i hiki ai i nā ʻātoma ma ka paʻa. waiho ka ʻili i ka paʻa a waiho ma ka ʻili substrate.ʻO ka paʻa paʻa ʻia ka mea maka no ka waiho ʻana i ke kiʻiʻoniʻoni ma o ka sputtering, i kapa ʻia ʻo sputtering target.
Ua hoʻohana nui ʻia nā ʻano mea kiʻiʻoniʻoni sputtered i nā semiconductor integrated circuits, recording media, planar display, tool and die surface coating a pēlā aku.
Hoʻohana nui ʻia nā pahuhopu sputtering i nā ʻoihana uila a me ka ʻike, e like me nā kaapuni i hoʻohui ʻia, ka mālama ʻana i ka ʻike, nā hōʻike aniani wai, nā hoʻomanaʻo laser, nā lako mana uila, etc.Hiki ke hoʻohana ʻia ma ke kahua o ka uhi aniani;Hiki ke hoʻohana ʻia i loko o nā mea ʻaʻahu ʻaʻahu, ke kiʻekiʻe wela o ka corrosion resistance, nā huahana hoʻonaninani kiʻekiʻe a me nā ʻoihana ʻē aʻe.
Nui nā ʻano o ka sputtering targets, a aia nā ʻano like ʻole no ka hoʻokaʻawale ʻana i nā pahu hopu:
E like me ka haku mele ʻana, hiki ke hoʻokaʻawale ʻia i ka pahu metala, ka pahu pahu a me ka pahu hoʻohui ceramic.
E like me ke ʻano, hiki ke hoʻokaʻawale ʻia i ka pahu lōʻihi, ka pahu pahu a me ka pahu pahu.
Hiki ke hoʻokaʻawale ʻia i microelectronic target, magnetic recording target, optical disk target, precious metal target, film resistance target, conductive film target, surface modification target, mask target, decorative layer target, electrode target and other targets like the application field.
Wahi a nā noi like ʻole, hiki ke hoʻokaʻawale ʻia i semiconductor e pili ana i nā pahu ceramic, ka hoʻopaʻa ʻana i nā pahu ceramic medium, hōʻike i nā pahuhopu ceramic, superconducting ceramic targets a me ka nui magnetoresistance ceramic targets.
Ka manawa hoʻouna: Iulai-29-2022