Hoʻomaka i ka hana a me ka hoʻohana ʻana i ka pahuhopu

E pili ana i ka huahana pahuhopu, i kēia manawa ua ʻoi aku ka ākea o ka mākeke noi, akā aia kekahi mau mea hoʻohana ʻaʻole maopopo loa e pili ana i ka hoʻohana ʻana i ka pahu hopu, e ʻae i nā poʻe loea mai RSM ʻenehana Oihana e hana i kahi kikoʻī kikoʻī e pili ana iā ia,

　　1. Microelectronics

Ma nā ʻoihana noi āpau, ʻo ka ʻoihana semiconductor ka mea koi nui loa no ka maikaʻi o ke kiʻi sputtering.Ua hana ʻia nā wafers silikon o 12 iniha (300 epistaxis).Ke emi nei ka laula o ka pilina.Pono nā mea hana wafer silikoni i ka nui nui, ka maʻemaʻe kiʻekiʻe, ka hoʻokaʻawale haʻahaʻa a me ka palaoa maikaʻi o ka pahuhopu, e koi ana i ka microstructure maikaʻi o ka pahuhopu i hana ʻia.

　　2, hōʻike

Ua hoʻopilikia nui ʻia ka hōʻike papa pālahalaha (FPD) i ka cathode-ray tube (CRT) -based computer monitor a me ka mākeke kīwī i nā makahiki, a e alakaʻi pū i ka ʻenehana a me ka noi mākeke no nā mea i manaʻo ʻia ITO.ʻElua ʻano o nā pahuhopu iTO.ʻO kekahi e hoʻohana i ke kūlana nanometer o ka indium oxide a me ka pauka tin oxide ma hope o ka sintering, ʻo ka mea ʻē aʻe e hoʻohana i ka indium tin alloy target.

　　3. Waihona

Ma keʻano o kaʻenehana mālama,ʻo ka hoʻomohalaʻana i nā diski paʻakikī kiʻekiʻe a me ka nui-nui e pono ai ka nui o nā mea kiʻi kiʻi nui.ʻO ka CoF~Cu multilayer composite film he mea hoʻohana nui ʻia o ke kiʻiʻoniʻoni pilikua.Ke hoʻomohala hou ʻia nei ka TbFeCo alloy target material e pono ai no ka disc magnetic.ʻO ka disc magnetic i hana ʻia me TbFeCo nā hiʻohiʻona o ka nui o ka mālama ʻana, ke ola lōʻihi a me ka pau ʻole o ka hoʻopili ʻana.

　　Ka hoʻomohala ʻana o nā mea i manaʻo ʻia:

Ua hoʻohana nui ʻia nā ʻano mea kiʻi ʻoniʻoni ʻoniʻoni ʻoniʻoni i nā semiconductor integrated circuits (VLSI), nā diski optical, nā hōʻike planar a me nā uhi ʻili o ka mea hana.Mai ka makahiki 1990, ua hoʻokō nui ka hoʻomohala ʻana o ka sputtering target material a me ka ʻenehana sputtering i nā pono o ka hoʻomohala ʻana i nā ʻāpana uila hou.