Māhele Sputtering Targets Māhele e Magnetron Sputtering Technology

Hiki ke hoʻokaʻawale ʻia i ka DC magnetron sputtering a me RF magnetron sputtering.

Pono ka DC sputtering method e hiki i ka pahu hopu ke hoʻololi i ka uku kūpono i loaʻa mai ke kaʻina hana hoʻopapa i ka cathode i pili kokoke me ia, a laila hiki i kēia ʻano ke sputter wale i ka ʻikepili conductor, ʻaʻole kūpono i ka ʻikepili insulation, no ka mea, ʻAʻole hiki ke hoʻokaʻawale ʻia ka hoʻouka ʻana o ka ion ma luna o ka ʻili i ka wā e hoʻokuʻu ai i ka pahuhopu insulation, kahi e alakaʻi ai i ka hoʻonui ʻana o ka hiki ma luna o ka ʻili i hoʻopaʻa ʻia, a kokoke i nā mea āpau i hoʻopili ʻia i ka pahu hopu, no laila ka manawa o ka wikiwiki o ka ion a me ka ionization ma waena o ka ʻelua mau pou e hoʻemi ʻia, a ʻaʻole hiki ke hoʻokaʻawale ʻia.No laila, pono e hoʻohana ʻia ka radio frequency sputtering (RF) no ka insulating targets a i ʻole nā ​​mea metala ʻole me ka conductivity maikaʻi ʻole.

ʻO ke kaʻina sputtering e pili ana i nā kaʻina hoʻopuehu paʻakikī a me nā kaʻina hoʻoili ikehu like ʻole: ʻo ka mea mua, hui pū ʻia nā ʻāpana hanana me nā ʻātoma i hoʻopaʻa ʻia, a e hoʻouna ʻia kahi ʻāpana o ka ikehu kinetic o nā mea i hana ʻia i nā ʻātoma.ʻOi aku ka ikehu kinetic o kekahi mau ʻātoma i hoʻopaʻa ʻia ma mua o ka pale kūpono i hana ʻia e nā ʻātoma ʻē aʻe a puni lākou (5-10ev no nā metala), a laila kikeke ʻia lākou mai ka lattice lattice lattice e hana i nā ʻātoma ma waho o ka pūnaewele, A hui hou ʻia me nā ʻātoma pili. , ka hopena o ka hoʻokuʻi ʻana.Ke piʻi aku kēia cascade collision i ka ʻili o ka pahu hopu, inā ʻoi aku ka nui o ka ikehu kinetic o nā atom kokoke i ka ʻili o ka pahu hopu ma mua o ka ikehu hoʻopaʻa ʻana i ka ʻili (1-6ev no nā metala), e hoʻokaʻawale kēia mau ʻātoma mai ka ʻili o ka pahu. a komo i ka vacuum.

ʻO ka sputtering coating ʻo ia ke akamai o ka hoʻohana ʻana i nā ʻāpana i hoʻopaʻa ʻia e hoʻopaʻa i ka ʻili o ka pahu i loko o ka momi i mea e hōʻiliʻili ai nā mea i hoʻopaʻa ʻia ma luna o ka substrate.ʻO ka maʻamau, hoʻohana ʻia ka hoʻokuʻu ʻana i ke kinoea inert haʻahaʻa no ka hoʻoulu ʻana i nā ion hanana.Hana ʻia ka pahu cathode i nā mea hoʻonaninani, hoʻohana ʻia ka substrate e like me ka anode, 0.1-10pa argon a i ʻole nā ​​​​gasana inert ʻē aʻe i hoʻokomo ʻia i loko o ke keʻena māmā, a hoʻokuʻu ʻia ka glow ma lalo o ka hana o ka cathode (target) 1-3kv DC maikaʻi ʻole kiʻekiʻe. uila a i ʻole 13.56MHz RF puʻupuʻu.Pahū nā ion argon ionized i ka ʻili o ka pahu hopu, no laila e paʻipaʻi a hōʻiliʻili nā ʻātoma i hoʻopaʻa ʻia ma luna o ka substrate e hana i kahi kiʻiʻoniʻoni lahilahi.I kēia manawa, nui nā ʻano sputtering, ʻoi aku ka nui o ka sputtering lua, tertiary a i ʻole quaternary sputtering, magnetron sputtering, target sputtering, RF sputtering, bias sputtering, asymmetric communication RF sputtering, ion beam sputtering a me reactive sputtering.

Ma muli o ka sputtered atoms ua splashed ma hope o ka hoʻololi kinetic ikehu me ka maikaʻi iions me ka umi o ka electron volts ikehu, ka sputtered atoms i kiʻekiʻe ikehu, i mea conducive i ka hoʻomaikaʻi i ka dispersion hiki o nā mana i ka stacking, hoʻomaikaʻi i ka fineness o stacking hoonohonoho, a me ka hana ana. ʻO ke kiʻi i hoʻomākaukau ʻia he adhesion ikaika me ka substrate.

I ka wā sputtering, ma hope o ke kinoea ionized, lele nā ​​kinoea kinoea i ka pahu hopu i hoʻopili ʻia i ka cathode ma lalo o ka hana o ke kahua uila, a lele nā ​​electrons i ka lua pā lepo a me ka substrate.Ma kēiaʻano, ma lalo o ka haʻahaʻa haʻahaʻa a me ka haʻahaʻa haʻahaʻa, liʻiliʻi ka helu o nā ion a haʻahaʻa ka mana sputtering o ka pahu hopu;Ma ka uila kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe, ʻoiai e hiki mai ana ka nui o nā ion, ʻo nā electrons e lele ana i ka substrate he ikaika kiʻekiʻe, hiki ke maʻalahi i ka wela i ka substrate a hiki i ka lua sputtering, e pili ana i ka maikaʻi o ke kiʻiʻoniʻoni.Eia kekahi, ua hoʻonui nui ʻia ka likelika o ka hui ʻana ma waena o nā atoms target a me nā molekele kinoea i ke kaʻina o ka lele ʻana i ka substrate.No laila, e hoʻopuehu ʻia i ka lua holoʻokoʻa, ʻaʻole ia e hoʻopau wale i ka pahuhopu, akā e hoʻohaumia hoʻi i kēlā me kēia papa i ka wā o ka hoʻomākaukau ʻana i nā kiʻiʻoniʻoni multilayer.

I mea e hoʻoponopono ai i nā hemahema i luna, ua hoʻomohala ʻia ka ʻenehana hoʻoheheʻe DC magnetron i nā makahiki 1970.Hoʻopau maikaʻi ia i nā hemahema o ka haʻahaʻa cathode sputtering rate a me ka piʻi ʻana o ka mahana substrate i hana ʻia e nā electrons.No laila, ua hoʻomohala wikiwiki a hoʻohana nui ʻia.

Penei ke kumu: ma ka magnetron sputtering, no ka mea, ua hoʻokau ʻia nā electrons neʻe i ka ikaika Lorentz i loko o ke kahua magnetic, ʻo kā lākou neʻe orbit e tortuous a i ʻole spiral, a e lōʻihi ko lākou ala neʻe.No laila, ua hoʻonui ʻia ka nui o nā collisions me nā molekele kinoea hana, i hoʻonui ʻia ka density plasma, a laila hoʻomaikaʻi nui ʻia ka wikiwiki o ka magnetron sputtering, a hiki ke hana ma lalo o ka haʻahaʻa haʻahaʻa haʻahaʻa a me ke kaomi e hoʻemi i ke ʻano o ka pollution kiʻiʻoniʻoni;Ma ka ʻaoʻao ʻē aʻe, hoʻomaikaʻi ia i ka ikehu o nā mea i hana ʻia ma ka ʻili o ka substrate, no laila hiki ke hoʻomaikaʻi ʻia ka maikaʻi o ke kiʻiʻoniʻoni i kahi nui.I ka manawa like, i ka wā e hiki ai i nā electrons i nalowale i ka ikehu ma o nā collisions he nui i ka anode, ua lilo lākou i electrons haʻahaʻa, a laila ʻaʻole e wela ka substrate.No laila, loaʻa i ka magnetron sputtering ka maikaʻi o ka "wikiwiki kiʻekiʻe" a me ka "maha haʻahaʻa".ʻO ka hemahema o kēia ʻano, ʻaʻole hiki ke hoʻomākaukau ʻia ke kiʻi insulator, a ʻo ke kahua magnetic uneven i hoʻohana ʻia i ka electrode magnetron e hōʻike i ka etching pono ʻole o ka pahuhopu, e hopena i ka helu hoʻohana haʻahaʻa o ka pahuhopu, ʻo ia ka 20% - 30 wale nō. %.