Ka noi a me ka loina o ka sputtering target

E pili ana i ka noi a me ka loina o ka sputtering 'ike loea, ua kukakuka kekahi mau mea kūʻai mai RSM, i keia manawa no keia pilikia i oi hopohopo e pili ana i , oaoieei akamai kaʻana like 'ike pili.

　　Sputtering target application:

ʻO ka hoʻouka ʻana i nā ʻāpana (e like me nā argon ions) e hoʻopā i kahi ʻili paʻa, e hoʻoheheʻe ʻia nā ʻāpana ʻili, e like me nā atom, nā molekala a i ʻole nā ​​pūʻolo mai ka ʻili o ka mea i kapa ʻia ʻo "sputtering".I loko o ka magnetron sputtering coating, hoʻohana mau ʻia nā iona maikaʻi i hana ʻia e ka argon ionization no ka hoʻopā ʻana i ka paʻa (pahu), a waiho ʻia nā ʻātoma kūʻokoʻa sputtered ma ka substrate (mea hana) e hana i kahi papa kiʻiʻoniʻoni.ʻElua mau hiʻohiʻona ka uhi ʻana o ka Magnetron sputtering: "haʻahaʻa haʻahaʻa" a me "wikiwiki".

　　ʻO ke kumu hoʻoheheʻe Magnetron:

Hoʻohui ʻia kahi kahua hoʻokalakupua orthogonal a me ka māla uila ma waena o ka pole target sputtered (cathode) a me ka anode, a ua hoʻopiha ʻia ke kinoea inert pono (maʻamau Ar kinoea) i loko o ke keʻena haʻahaʻa kiʻekiʻe.Hoʻokumu ka magnet paʻa i kahi māla magnetic 250-350 Gauss ma ka ʻili o ka mea i hoʻopaʻa ʻia, a hana i kahi kahua electromagnetic orthogonal me ke kahua uila uila kiʻekiʻe.

Ma lalo o ka hana o ka uila, Ar kinoea ua ionized i loko o ka maikaʻi iions a me nā electrons, a aia kekahi mau kino kiʻekiʻe puʻe ma luna o ka pahu hopu, no laila, i ka electrons emitted mai ka pahu pahu hopu e pili ana i ka magnetic kahua a me ka ionization probability o ka hana. piʻi ke kinoea.Hoʻokumu ʻia kahi plasma kiʻekiʻe kiʻekiʻe ma kahi kokoke i ka cathode, a holo wikiwiki nā Ar i ka ʻili i hoʻopaʻa ʻia ma lalo o ka hana a Lorentz ikaika a hoʻopaʻa i ka ʻili i hoʻopaʻa ʻia i ka wikiwiki kiʻekiʻe. ikehu kinetic a lele i ka substrate e hana i kahi kiʻiʻoniʻoni e like me ke kumu o ka hoʻololi ʻana.

Hoʻokaʻawale ʻia ʻo Magnetron sputtering i ʻelua ʻano: DC sputtering a me RF sputtering.He mea maʻalahi ke kumumanaʻo o nā mea hoʻoheheʻe DC, a wikiwiki ka wikiwiki i ka wā e hoʻoheheʻe ai i ka metala.ʻOi aku ka nui o ka hoʻohana ʻana i ka RF sputtering, ma waho aʻe o ka sputtering conductive material, akā hoʻi i ka sputtering non-conductive material, akā pū kekahi reactive sputtering hoʻomākaukau o nā oxides, nitrides a me ka carbide a me nā mea hoʻohui ʻē aʻe.Inā piʻi ka alapine o RF, lilo ia i ka microwave plasma sputtering.I kēia manawa, hoʻohana mau ʻia ka ʻano microwawe plasma sputtering electron cyclotron resonance (ECR).