ʻO ka Magnetron sputtering coating kahi ʻano hoʻoheheʻe kino kino hou, ke hoʻohālikelike ʻia me ke ʻano o ka uhi ʻana o ka evaporation ma mua, ʻo kona mau mea maikaʻi i nā ʻano he mea kupaianaha loa.Ma ke ʻano he ʻenehana makua, ua hoʻohana ʻia ka magnetron sputtering ma nā ʻano he nui.
ʻO ke kumu hoʻoheheʻe Magnetron:
Hoʻohui ʻia kahi kahua hoʻokalakupua orthogonal a me ka māla uila ma waena o ka pole target sputtered (cathode) a me ka anode, a ua hoʻopiha ʻia ke kinoea inert pono (maʻamau Ar kinoea) i loko o ke keʻena haʻahaʻa kiʻekiʻe.Hoʻokumu ka magnet paʻa i kahi māla magnetic 250-350 gaus ma ka ʻili o ka mea i hoʻopaʻa ʻia, a ua haku ʻia ke kahua electromagnetic orthogonal me ke kahua uila uila kiʻekiʻe.Ma lalo o ka hopena o ka uila, Ar kinoea ionization i loko o ka maikaʻi iions a me nā electrons, pahu hopu a loaʻa i kekahi puʻe maikaʻi ʻole, mai ka pahu hopu mai ka pole e ka hopena o ka mākia a me ka hoʻonui ʻana i ke kinoea hana ionization, hana i kahi plasma kiʻekiʻe kokoke i ka cathode, Ar ion ma lalo o ka hana a ka lorentz ikaika, e holo wikiwiki i ka lele i ka ili pahu hopu, bombarding ili pahu hopu ma ka kiʻekiʻe māmā holo, Nā'ātoma sputtered ma luna o ka pahu hopu hahai i ka loina o ka momentum huli ana a lele aku mai ka pahu hopu me ka kinetic kiʻekiʻe. ikehu i ke kiʻi hoʻomoe substrate.
Hoʻokaʻawale ʻia ʻo Magnetron sputtering i ʻelua ʻano: DC sputtering a me RF sputtering.He mea maʻalahi ke kumumanaʻo o nā mea hoʻoheheʻe DC, a wikiwiki ka wikiwiki i ka wā e hoʻoheheʻe ai i ka metala.ʻOi aku ka nui o ka hoʻohana ʻana i ka RF sputtering, ma waho aʻe o ka sputtering conductive material, akā hoʻi i ka sputtering non-conductive material, akā pū kekahi reactive sputtering hoʻomākaukau o nā oxides, nitrides a me ka carbide a me nā mea hoʻohui ʻē aʻe.Inā piʻi ka alapine o RF, lilo ia i ka microwave plasma sputtering.I kēia manawa, hoʻohana mau ʻia ka ʻano microwawe plasma sputtering electron cyclotron resonance (ECR).
ʻO ka mea i hoʻopaʻa ʻia e ka Magnetron sputtering coating:
Mea hoʻoheheʻe ʻia metala, ka uhi ʻana i ka mea hoʻoheheʻe ʻia, ka mea hoʻoheheʻe ʻia, ka mea hoʻoheheʻe ʻia, ka boride ceramic sputtering mea pahuhopu, carbide ceramic sputtering mea pahuhopu, fluoride ceramic sputtering mea pahuhopu, nitride ceramic sputtering mea pahuhopu, oxide ceramic target, selenide ceramic mea, sputtering material. nā mea i hoʻopaʻa ʻia i ka silicide ceramic sputtering, sulfide ceramic sputtering mea pahuhopu, Telluride ceramic sputtering target, nā pahu pahu ʻē aʻe, chromium-doped silicon oxide ceramic target (CR-SiO), indium phosphide target (InP), lead arsenide target (PbAs), indium arsenide pahuhopu (InAs).
Ka manawa hoʻouna: ʻAukake-03-2022