Welina mai i kā mākou mau pūnaewele!

ʻO nā mea hoʻopili ʻo Magnetron Sputtering me nā pahuhopu Sputtering like ʻole

TiB2

ʻO ka wehewehe pōkole:

Māhele Caumic Sputtering Target
ʻO ke kimekema TiB2
Huina ʻO Titanium Diboride
Maemae 99.5%99.9%99.95%99.99%
Kinohi ʻO nā pā, nā pahu pahu, nā cathodes arc, hana maʻamau
Pkaʻina hana Vacuum hehee,PM
Nui Loaʻa L200mm,W200mm

Huahana Huahana

Huahana Huahana

ʻO kā mākou pahuhopu nui ka hāʻawi ʻana i kā mākou mea kūʻai aku i kahi pilina ʻoihana liʻiliʻi koʻikoʻi a kuleana, e hāʻawi ana i ka nānā pilikino iā lākou āpau no ka Magnetron Sputtering Coating Materials with Different Sputtering Targets, inā he nīnau a makemake paha ʻoe e kau i kahi kūʻai mua e ʻike pono e hāʻawi. Mai kali e kelepona mai iā mākou.
ʻO kā mākou pahuhopu nui e hāʻawi i kā mākou mea kūʻai aku i kahi pilina ʻoihana liʻiliʻi koʻikoʻi a kuleana, e hāʻawi ana i ka nānā pilikino iā lākou a pau noKina Sputtering Target a me Magnetron Target, Ma ka hoʻohui ʻana i ka hana ʻana me nā ʻāpana kalepa ʻē aʻe, hiki iā mākou ke hōʻike i nā hopena o nā mea kūʻai aku ma o ka hōʻoia ʻana i ka lawe ʻana i nā mea kūʻai kūpono i kahi kūpono i ka manawa kūpono, i kākoʻo ʻia e kā mākou mau ʻike nui, ka mana hana ikaika, ka maikaʻi kūlike, nā huahana like ʻole a me ka ka mālama ʻana i ke ʻano o ka ʻoihana a me ko mākou oʻo ʻana ma mua a ma hope o nā lawelawe kūʻai.Makemake mākou e kaʻana like i ko mākou mau manaʻo me ʻoe a hoʻokipa i kāu mau manaʻo a me kāu mau nīnau.

ʻO ka pauka Titanium diboride TiB2 he hina a hina-ʻeleʻele, me kahi ʻano aniani hexagonal (AlB2), me kahi helu heheʻe o 2980 ° C a me ka paʻakikī kiʻekiʻe.ʻO ka mahana anti-oxidation o ka titanium diboride i ka lewa hiki ke hiki i 1000 ℃, a paʻa ia i ka HCl a me ka HF acid.

Hiki ke hoʻohana ʻia ka Titanium diboride i ka hana ʻana i ka pahu metala hoʻoheheʻe a me ka electrode o ka pahu electrolytic ma muli o kona kūpaʻa ʻana mai ka metala hehee.ʻO ia kekahi ʻano o nā mea seramika conductive, ʻo ia kekahi o nā kumu waiwai nui no ka moku evaporation conductive no ke kumu uhi uhi.ʻO TiB2 ka mea maka no nā mea ʻoki ʻoki a me nā mold, e pili ana i ka hana ʻana i ka pahi, wortle, extrusion die, blast nozzle a me nā mea hoʻopaʻa.Hiki i ka Titanium diboride ke hoʻohui pū me TiC, TiN, SiC e hana i nā ʻano mea hoʻohuihui multielement.No nā ʻāpana wela kiʻekiʻe a me nā ʻāpana hana e like me ke kiʻekiʻe wela wela a me nā ʻāpana mīkini.ʻO ia kekahi o nā mea palekana maikaʻi loa no Armor.ʻO TiB2 ka uhi cathode no ka cell electrolysis aluminika.Hoʻohana ʻia ia i ka hoʻomākaukau ʻana i ka thermal PTC ceramic material a me nā mea PTC palupalu.He mea hoʻonui nui ia no Al, Fe, Cu a me nā mea metala ʻē aʻe.

 

Mat. Maemae ʻO ka mānoanoa(g/cm3) Ka palaoa (μm) TC((W/(m·k)) CTE[1/K]
TiB2 99.7 4.40 2 64 7.4Χ10-6

ʻO Rich Special Materials kūikawā i ka hana ʻana i ka Sputtering Target a hiki ke hana i nā Titanium Diboride Sputtering Materials e like me nā kikoʻī o nā mea kūʻai aku.No ka 'ike hou aku, e 'olu'olu e leka uila mai.

ʻO kā mākou pahuhopu nui, ʻo ia ka hāʻawi ʻana i kā mākou mea kūʻai aku i kahi pilina ʻoihana liʻiliʻi koʻikoʻi a kuleana, e hāʻawi ana i ka nānā pilikino iā lākou a pau no nā mea hoʻokūkū hoʻokūkū paʻa Magnetron Sputtering Coating Materials me nā ʻokoʻa Sputtering Targets, inā he nīnau a makemake paha ʻoe e kau i kahi kūʻai mua. ʻaʻole e kali e kelepona iā mākou.
Kumukūʻai hoʻokūkū paʻaKina Sputtering Target a me Magnetron Target, Ma ka hoʻohui ʻana i ka hana ʻana me nā ʻāpana kalepa ʻē aʻe, hiki iā mākou ke hōʻike i nā hopena o nā mea kūʻai aku ma o ka hōʻoia ʻana i ka lawe ʻana i nā mea kūʻai kūpono i kahi kūpono i ka manawa kūpono, i kākoʻo ʻia e kā mākou mau ʻike nui, ka mana hana ikaika, ka maikaʻi kūlike, nā huahana like ʻole a me ka ka mālama ʻana i ke ʻano o ka ʻoihana a me ko mākou oʻo ʻana ma mua a ma hope o nā lawelawe kūʻai.Makemake mākou e kaʻana like i ko mākou mau manaʻo me ʻoe a hoʻokipa i kāu mau manaʻo a me kāu mau nīnau.


  • Mua:
  • Aʻe: